What is the development mode of thermal conductive silica gel in the field of Electronics?
As a kind of heat conducting medium, heat conducting silicon film can effectively reduce the thermal resistance caused by the contact between the surface of heat source the contact surface of radiator, avoid the slow down of equipment operation many other performance problems caused by the rise of temperature of electronic components.
Heat conductive silica gel gasket has the properties of heat conduction, insulation, shockproof, etc. for these problems in the electronic industry, heat conductive silica gel gasket can solve the problems of the equipment. The soft surface of heat conductive silica gel gasket has its own viscosity, it is easy to operate. It can be applied between the surface of various irregular parts, radiator, shell, etc. to play a heat conductive filling role. Thermal conductive silica gel gasket also plays an important role in the use of electronic products.
In today's indispensable era of electronic products, how to effectively take away more heat generated by larger unit power improve the service life of electrical appliances under the condition of smaller smaller operating space is a problem that every thermal silicon chip manufacturer should consider.
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