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What is the technology principle of heat conduction silicone gasket?

2020-04-09 13:46:05

Due to the rapid development of integration technology assembly technology in the field of electrical electronic, the volume of electronic components logic circuits has shrunk by tens of thousands of times. Therefore, insulating materials with higher thermal conductivity are needed to solve the problem of heat dissipation. In recent decades, the application field of polymer materials has been expanding. Using synthetic polymer materials to replace the metal materials used in traditional industry has become one of the directions of scientific research in the world. Next, Huiqi Electronics will talk with you about: what is the technology principle of heat conduction silicone gasket?

1、 What is the heat conductive silica gel gasket made of

With silica gel as the base material, some metal oxides various heat conduction auxiliary materials are added, then the heat conduction silica gel sheet is synthesized by special process. Thermal conductive silica gel pad is a kind of polymer composite thermal conductive material with silicone resin as bonding base material filled with thermal conductive powder to achieve thermal conductivity

2、 Common base materials auxiliary materials for making guide silicon gasket

Silicone resin (basic material)

1. Insulating heat conducting material powder: magnesium oxide, aluminum oxide, boron nitride, beryllium oxide, aluminum nitride, quartz other organosilicon plasticizers

2. Flame retardant: magnesium hydroxide, aluminum hydroxide

3. Inorganic colorant (used to fill the product with specific color)

4. Crosslinking agent (make the product with micro viscosity)

5. Catalyst (process forming requirements)

Note: the heat conducting silica gel pad plays a heat conducting role, forming a good heat conducting path between the heating body the heat dissipating device can fill the gap

The filler consists of the following metal inorganic filler:

1. Metal powder filler: copper powder, aluminum powder, iron powder, tin powder, nickel powder, etc;

2. Metal oxide: alumina, bismuth oxide, beryllium oxide, magnesium oxide, zinc oxide;

3. Metal nitrides: aluminum nitride, boron nitride, silicon nitride;

4. Inorganic nonmetal: graphite, silicon carbide, carbon fiber, carbon nanotube, graphene, beryllium carbide, etc

3、 The heat conducting sheet can be divided into heat conducting silica gel gasket non silica gel gasket

The insulation performance of most heat conducting silica gel pads is determined by the insulation performance of filler particles.

1. Heat conductive silica gel pad

According to the thermal conductivity of the product the surface additives, the thermal conductive silica gel pad can be divided into many categories, none of which has its own different characteristics

2. Non silicon silicone gasket

The non silicon silicon gasket is a kind of material with high thermal conductivity. It is self-adhesive on both sides. It has low thermal resistance good electrical insulation characteristics under low pressure shrinkage when assembling using electronic components. It can work stably at - 40 ℃ ~ 150 ℃. Meet the requirements of flame retardant grade of UL94V0

4、 Working principle of thermal conductive silica gel pad

General description: the thermal conductivity of the thermal conductive silica gel pad depends on the interaction between the polymer the thermal conductive filler. Different types of fillers have different heat conduction mechanisms

1. Heat conduction mechanism of metal filler

The heat conduction of metal fillers mainly depends on the movement of electrons, which transfers the corresponding heat during the movement of electrons

Heat conduction mechanism of metal filler

2. Heat conduction mechanism of non-metallic filler

The heat conduction of non-metallic fillers mainly depends on the phonon heat conduction, the heat diffusion rate mainly depends on the vibration of adjacent atoms binding groups. Including metal oxides, carbides, nitrides, etc

Heat conduction mechanism of non-metallic fillers

Well, the above is the technology principle of heat conduction silicone gasket shared by Huiqi. I hope you can understand the technology the heat conduction principle of silicone rubber gaskets after finishing reading what questions you have about thermal conductivity gel.



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