What is the necessity of applying heat conductive double faced adhesive to aluminum substrate?

     Although the aluminum substrate has processed the circuit led to the aluminum substrate, which can deliver the heat to the aluminum plate, unfortunately, the aluminum plate is the final radiator, it is usually connected to the real radiator. The simplest door diameter is to connect the radiator with the door diameter of rivet screw. However, such door diameter often forms air gap, The thermal resistance of a very small air gap is dozens of times larger than that of the other. Because the thermal conductivity of air is 0.023w/m · K, it is necessary to apply a thermal conductive adhesive to fill the gap. The thermal conductivity of ordinary thermal conductive silica gel is roughly 1-2W / m · K. but the thermal conductive paste must have good fluidity, otherwise, the air gap will still be set due to the uneven application, Another disadvantage of the thermal conductive paste is that its viscosity is enough to fix the aluminum substrate on the aluminum radiator.

Therefore, another kind of gate is a double-sided film with strong adhesive heat conduction. This kind of heat conduction film is a kind of heat conduction film with viscosity made of propylene series materials, which belongs to the heat dissipation material with viscosity low heat resistance. Besides, it has heat conductivity softness, can be close to the concave convex parts of parts, The thermal conductivity of the thermal conductive silicon film is usually between 2-3W / m · K. its tensile strength can reach 8kg / cm2. It is enough to bond the aluminum substrate the aluminum radiator. The pressure resistance can reach 4KV / mm. Sa400fg series products are widely used for bonding heat sinks to microprocessors other power consuming semiconductors. These tapes have very strong bonding strength small thermal impedance, which can effectively eliminate silicone grease mechanical fixation.