How should thermal conductive silicon film be used correctly?

As a mature stable product, thermal conductive silicon film is also widely used in the market, involving a wide range of applications. No matter in communication industry, electronic industry, LED industry, thermal conductive silicon film will be one of the thermal conductive products considered by manufacturers, so thermal conductive silicon film has more advantages than other thermal conductive products. So how to use the thermal conductive silica gel correctly?

At the beginning of product design, thermal conductive silicon film should be added to product structure design. It is required that the heat-conducting silica gel sheet can perfectly solve the heat-conducting problem of the product, fit the product design facilitate the installation.

1. Selection of heat conduction scheme

The development trend of electronic products tends to be increasingly light thin, the former heat conduction mode is mainly based on the heat sink scheme; with the development of heat conduction technology of electronic products, now it is more inclined to use the structural heat sink mainly composed of metal bracket metal shell, the combination of the two schemes. In a word, in different products different use environments, choose the best heat conduction solution with the best cost performance perfect use of heat conduction silica gel.

2. If you choose the heat conduction piece scheme

The heat sink scheme can use heat-conducting double-sided adhesive, heat-conducting silicone grease other heat-conducting materials. However, the heat conduction effect of the double-sided heat conduction adhesive is relatively weak, the heat conduction silicone grease does have the shock absorption compression resistance ability, so the light thin heat conduction silicone film can be selected. The heat conduction effect of the heat conduction silicone film including whether the silicon heat conduction film is better, which is convenient for operation.

3. structural parts for heat dissipation

For the heat dissipation of structural parts, it is inevitable to combine the heat-conducting silicon film with the heat-conducting radiator components in the contact surface protrusion so on. Try to choose the non thick thermal conductive silica gel sheet when the product design allows.

Good heat-conducting materials, coupled with the correct use method, can make the heat-conducting silica gel sheet perfectly solve the heat dissipation problem of electronic products.

Dongguan Huiqi Electronic Technology Co., Ltd. is a high-tech enterprise integrating R & D, sales, production processing as well as after-sales service. Its products are widely used in the fields of new energy power battery, LED TV, communication equipment, smart phone, server, computer its surrounding electronic components, etc., providing customers with diversified heat dissipation solutions. The company's cooling materials come the technology formula of the United States Taiwan, with strong R & D capabilities, can meet the requirements of customers for different levels of cooling products, has advanced die-cutting molding equipment in the industry, which can cut shape products according to customers' various needs. The company has more than ten years of experience in the industry, has passed ISO9001, 14001 other management systems, all products have obtained industry certification, in line with the EU environmental protection requirements, has a third-party testing agency certification. At present, the main products are heat-conducting phase change materials, heat-conducting silica gel sheets, heat-conducting insulation materials, heat-conducting double-sided adhesive, heat-conducting paste other products.