What factors affect the thermal conductivity of silica gel?

Thermal conductive silica gel is a very commonly used thermal conductive material for electronic electrical products. Because of its superior thermal conductivity practical performance, it has been widely used in many fields. What factors affect the thermal conductivity of thermal conductive silica gel?

Factors affecting thermal conductivity of silica gel:

Types characteristics of polymer matrix materials: the higher the thermal conductivity of the matrix materials, the better the dispersion of fillers in the matrix the better the bonding degree between the matrix fillers, the better the thermal conductivity of the thermal conductive composite materials.

Types of fillers: the higher the thermal conductivity of fillers, the better the thermal conductivity of thermal conductive composites.

Shape of filler: Generally speaking, the order of easy formation of heat conduction path is whisker > fibrous > flake > granular. The easier the filler forms heat conduction path, the better the heat conduction performance.

Filler content: the distribution of filler in polymer determines the thermal conductivity of composite. When the filler content is small, the heat conduction effect is obvious; when the filler is too much, the mechanical properties of the composite will be greatly affected. When the content of fillers increases to a certain value, the interaction between fillers forms a heat conduction network chain similar to a mesh chain in the system. When the direction of the heat conduction network chain is consistent with the direction of heat flow, the heat conduction performance is the best.

The bonding characteristics of the interface between the filler the matrix material: the higher the bonding degree between the filler the matrix, the better the thermal conductivity. The thermal conductivity of the filler can be increased by 10% - 20% by selecting the appropriate coupling agent for the surface treatment.

According to the thermal conductivity, the appropriate thermal conductive silica gel:

The most important choice of thermal conductivity is the power consumption of the heat source the heat dissipation capacity of the radiator the heat dissipation structure. Generally, the chip temperature specification parameter is relatively low, it is relatively sensitive to temperature, the heat flow density is relatively large (generally more than 0.6w/cm3, heat dissipation treatment is required, generally when the surface is less than 0.04w/cm2, only natural convection treatment is required). These chips heat sources need heat dissipation treatment, try to the heat conduction silica gel with high thermal conductivity. The above is about the thermal conductivity of thermal conductive silica gel suggestions for purchase sharing. Choosing the right thermal conductive silica gel can better play the product's performance improve the stability.