Thermal conductive silicon sheet
Details
Features
Parameter
一、Product description
Good thermal conductivity ：5.0W/mK，Low thermal resistance | Good insulation |
| Solid, soft, with natural viscosity |
二、Application area
| LED | Power Cell |
| Network terminal | Consumer Electronics |
| Communication equipment | New Energy Vehicle |
| Aerospace | data transmission |
三、Technical parameter
| Series | HQ-P500 | Test Standard | ||||||
| Color | All colors | Visual inspection | ||||||
| Thickness(mm) | 0.25-10.0 mmT | ASTM D374 | ||||||
| Density(g/cc) | 2.98 | ASTM D297 | ||||||
| Thermal volume | 1 J/g-K | ASTM C351 | ||||||
| Hardness/(Shore C） | 25 | ASTM 2240 | ||||||
| Sustainable operating temperature（℃） | -50 to 200 | HUIQI METHOD | ||||||
| BREAKDOWN VOLTAGE（KV）@1mm | >10 | ASTM D149 | ||||||
| Volume resistivity | 3.1X1011Ohm-meter | ASTM D257 | ||||||
| Flame retardant grade | V-0 | UL 94 | ||||||
| Thermal conductivity(W/m-K) | 5.0 | ASTM D5470 | ||||||
四、Thermal Resistance Characteristics V. S. Pressure thickness 1mm sample for reference
| Pressure(Psi) | 5 | 10 | 20 | 30 | 40 | |||
| Thermal resistance(℃-in²/W) | 0.36 | 0.3 | 0.24 | 0.21 | 0.29 | |||
| Compression ratio（%） | 8% | 14% | 21% | 26% | 29% | |||
五、Product description
Thermally conductive silicone sheets fill the air gap between the heating element the heatsink metal base, their flexible, elastic properties allow them to be used to cover very uneven surfaces. Heat is transferred the separator the entire PCB to the metal housing diffusion plate, thus improving the efficiency service life of the heating electronic component.
六、Warehousing
| Shelf Life: 12 months | Storage conditions: room temperature, cool dry place |
| Relative humidity：RH<70% |