Heat conductive silica gel sheet

Heat conductive silica gel sheet

Details

Features

Parameter

一、Product Brief


Good thermal conductivity: 5.0w/mk, low thermal resistanceExcellent insulating material
Solid, soft, natural self-adhesive


二、application area


LEDPower battery
network terminalConsumer electronics
Communication equipmentNew energy vehicles
Aerospacedata transmission


三、technical parameter

seriesHQ-P500
Testing standard
colourAllvisual
thickness(mm)0.25-10.0 mmTASTM D374
density(g/cc)2.98ASTM D297
Thermal volume1 J/g-KASTM C351
hardness/(Shore C)25ASTM 2240
Sustainable operating temperature(℃)-50 to 200HUIQI METHOD
Breakdown voltage (kV)@1mm>10ASTM D149
Volume resistivity3.1X1011Ohm-meterASTM D257
Flame retardant gradeV-0UL 94
Thermal conductivity(W/m-K)5.0 ASTM D5470


四、Thermal resistance characteristic v.s. pressure (1mm thickness sample as reference)

pressure(Psi)510203040
thermal resistance(℃-in²/W)0.360.30.240.210.29
Compression ratio(%)8%14%21%26%29%




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五、Product description


     

The thermal conductive silica gel sheet is used to fill the air gap between the heating device  the heat sink  the metal base. Its flexible  elastic characteristics enable it to cover the very uneven surface. Heat is transferred  the separating device  the whole PCB to the metal shell

on the diffusion plate, thereby improving the efficiency  service life of the heating electronic components.


六、Storage


Storage validity: 12 monthsStorage conditions: cool  dry place under normal temperature  
Relative humidity: RH < 70%




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